HyperBGA(r) Semiconductor Package Delivers Higher Speeds, Better Reliability Than Ceramic BGAs
I2C(tm) EEPROMs Available in WLCSP, 5-pin SC-70 and SOT-23 Packages; Reduce Design Size and Profile with Die-Sized Packages
Surface Acoustic Wave (SAW) technology enables robust wireless sensor operation minus the batteries.
AtSmart Systems Integration Conference in Brussels (Belgium), technologists from IMEC and its associated laboratory at Ghent University presented a new 3D integration process.
New Solution Ensures Supply Chain Integrity for Aviation and Other Cargo
