ADLINK’s Express-LPC, measuring only 95 x 95 mm, is an entry level COM Express(r) Type 2 Computer-on-Module targeting highly compact, low power, calculation intensive applications.

More and more industrial applications are requiring high-performance platforms with compact size and flexible functionality, as well as the ability to operate in harsh environments such as those with high ambient temperature, constant vibration, and sudden shock. In machine-to-machine factory automation for example, a computing platform is required to operate inside another device, as a processing core or building block. With limited space and access to maintenance, the platform has to be extremely reliable and compact, while maintaining flexibility to provide wide varieties of functionality to match a wide array of industrial applications.

Leveraging the advantages of enhanced RF function, dedicated I/O features, 9-32 VDC wide range power input, and LVDS & VGA dual display support, the MXE-3000 with ease of mounting capability – VESA or DIN rail – is an ideal match for diverse applications such as intelligent transportation, digital signage, factory automation, and logistic applications, and especially in automated guided vehicle systems.

Product focus includes platforms featuring the 2nd generation Intel(r) Core(tm) processor family and the Intel(r) Atom(tm) processor E6xx series as well as rugged fanless embedded computers and compact vision systems

Product focus includes platforms featuring the 2nd generation Intel(r) Core(tm) processor family and the Intel(r) Atom(tm) processor E6xx series as well as rugged fanless embedded computers and compact vision systems