2GB DDR2 SO-DIMM in COB Technology for Industrial PCs and Aggressive Environmental Conditions

Built from 1Gb DDR2 dies with Winbond "buried wordline" process together with Swissbit’s COB manufacturing technology

August 23rd, 2010

Bronschhofen, Switzerland – Swissbit is proud to announce an addition to its INDUSTRIAL family of high performance / high reliability SDRAM memory modules, the 2GB DDR2 Chip-On-Board (COB) SODIMM. Built from 1Gb DDR2 dies with Winbond “buried wordline” process together with Swissbit’s COB manufacturing technology, this module is ideally suited for industrial small form factor (SFF) PCs and other space-constrained industrial applications. The COB technology directly attaches and wire-bonds the DRAM dies to the substrate and fully covers the dies and bond wires with a protective Epoxy encapsulating material (glob top). With this process the module becomes mechanically robust against shock and vibration, along with an overall reduction of electrical interconnections. Due to the direct die attachment the heat dissipation is enhanced via the substrate and socket and by the extended surface. This keeps the DRAM dies at a lower temperature under limited airflow conditions and increases the electrical performance / reliability. The glob top encapsulation also provides an excellent platform for conformal coating which can optionally be added as an additional protection against aggressive environmental conditions.

The Winbond “buried wordline” process is a low power technology with very small internal parasitic capacitors and high data retention, making this small outline memory module ideal for applications within industrial temperature range. With Winbond’s commitment to the long product life cycles of the industrial market, Swissbit will be able to offer the 2GB DDR2 COB module without BOM or design revision changes for at least 5 years.

Intensive testing during Burn-In at low and high temperatures guarantees the highest quality product. Availability of this module is in both commercial 0°C to +85°C (TCase) and industrial -40°C to +95°C (TCase) temperature grades at PC2-5300 and PC2-6400 speed grade. Swissbit will also offer a 1 inch module height 1GB DDR2 COB SODIMM in the near future.

Please visit the Swissbit website at www.swissbit.com for more contact options and information about Swissbit’s full line of DRAM and Flash memory products. All Swissbit Flash and DRAM memory products are RoHS and REACH compliant.

Topics covered in this article

The new shape of industrial computing, networking, and sensing
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